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TSMC

A14 R&D Integration Engineer

Early Applicant
  • 3 months ago
  • Be among the first 50 applicants

Job Description

Aspire to be a part of a visionary team that develops world-class, cutting-edge technology for the A14 platform This is a call to those who wish to delve into the realm of interconnect and chip/package (2D/3D) co-optimization, where your work will be integral to our success.

Description:

1. Championing Technological Excellence:

(1) Optimization Wizardry: Ensure the A14 program excels by harmonizing process requirements across performance, yield, reliability, and manufacturability through strategic process integration and baseline maintenance.

(2) Design & Validation Expertise: Lead the tape-out process and rigorously test key designs to validate design rules, refine electrical modeling, and elevate yield outcomes.

(3) Benchmarks & Characterization: Analyze and characterize the electrical performance relative to the process, establish SPICE modeling benchmarks, and perform selective bench measurements to guarantee precision and quality.

2. Collaborative Innovation:

(1) Analytical Problem-Solving: Bring your innovative mindset to team efforts, using data analysis to uncover process issues and co-developing new processes as solutions alongside talented peers.

(2) Process Evolution: Play a pivotal role in evolving processes from advanced integration baselines to full-scale volume production, ensuring a smooth transition and exemplary results.

Qualifications:

1. A masters degree or Ph.D. in Electronics Engineering, Materials Science, Chemical Engineering, or a knowledge domain in semiconductor interconnect, advanced packaging or a related field.

2. Personal traits:

(1) Growth mindset with dedication to learning.

(2) Collaborative with good communication skills, able to work with cross-functional teams.

(3) Proactive, self-driven, and goal-oriented with strong technical problem-solving abilities, analytical skills, and a strong sense of ownership.

3. Experience in the process integration, semiconductor interconnect processes or advanced 3D packaging is preferred.

4. Good command of English is preferred.

Skills Required

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Date Posted: 07/08/2024

Job ID: 87830675

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Last Updated: 20-11-2024 10:34:42 PM
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