- Responsible for Solder printing / Die attach / Clip bond / Reflow / Flux clean / Die Top Printing
process development, which included new machine, material evaluation and process
characterization.
- Yield and failure rate improvement by 8D approach
- To conduct the proper training to technician for new process /machine introduction
- To establish risk assessment document (like DFEMA/PFMEA) , mitigation DoE plan and quality
control document to support new package platform development and release.
