Coating Process Development (J46512)

Job Responsibilities

1. Responsible for CVD process development of high aspect ratio, NDC, TEOS silicon oxide materials and TiN/Ta/TaN/Cu PVD deep hole coating
2. Responsible for CVD/PVD equipment evaluation and operation
3. Responsible for the main analysis and improvement of CVD/PVD related process problems and defects

Qualifications

Education level: Bachelor
Work experience:
3 years and above
1. Proficient in CVD/PVD process, familiar with the process flow and details of Hybrid Bonding related SiCN, SiO filling, TEOS coating and TiN/Ta/TaN/Cu PVD deep hole coating, with advanced packaging work experience preferred
2. Experience in new material development and introduction preferred
3. Good data analysis ability and ability to solve daily work problems
4. Good coordination and communication skills, able to accurately convey information and accept assistance
5. Have a certain ability to withstand pressure and can actively undertake related tasks assigned by the leader