Electronical Engineering Manager

Job Description:

1. ICC2, Innvous for IO/IP planning, placement, bump & RDL.
2. Physical verification. Be familiar with package flow is better
3. Knowledge about process, ESD protect principle to do fullchip ESD design.
4. Perform power analysis with PTPX and IR/EM analysis with Redhawk or voltus.
5. Develop Perl/TCL/Shell scripts for flow and procedure automation
6. Work proactively with EDA engineers and tool suppliers to debug tool functionality and bugs
7. Design optimization of 2.5D/3D advanced silicon/package technology features to enable strong product differentiation.
8. 2.5D/3D -IC Test Chips validation of 2.5D/3D -IC technology platforms and design methodology.

Education/License:

B. Tech or M. Tech in Electronics Engineering, Computer Science, or related field (or equivalent experience)

Working Experience:

5+ years of experience in the areas of silicon power & signal integrity analysis (power consumption, IR drop, EM, ESD, etc.). Expertise with advanced package solutions (eg. CoWoS, InFO, SOIC) and sign-off flow (SI, PI, PV, timing check, thermal, mechanical), which proved by Testchip designs and/or Product designs.

Professional Knowledge:

Effective English verbal/written communication, and technical presentation skills

Self-starter with strong skills in multi-tasking, influencing, communication, presentation, and consensus-building