Micron PDE Package Development Engineer

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR67509 Micron PDE Package Development Engineer (Evergreen)

Job Description

Micron's Package Development Engineering team in India is looking for motivated and experienced individual contributors for this position in Development team. A good candidate will be developing, configuring and optimizing Package Assembly processes for Micron's memory from pathfinding through to NPI start up and certification side by side with Manufacturing teams. Assessing processes by knowledge and skills, taking measurements and interpreting data are daily responsibilities and expectations for the successful candidate. Other deliverables in this job function are co-work with cross-function team globally and you will be one of following team, such as design team, process develop team, material team or equipment team, to be involved in the product design and developing phases. An important topic is the path finding of innovative package technology: Deep fundamental understanding of the key risks and improve product qualities.

Responsibilities

• Participate taskforce which requires solution of issues encountered during package development.
• Be the Point-of Contact pertaining to all aspects of assigned products/modules
• Engineering champion and participate in monthly PDE Engineering forum and discussions
• Development and Qualification of new direct and indirect materials, equipment, and tech nodes.
• Ensure product quality and process performance while driving projects focused on cost reduction, productivity improvement, risk mitigation, and resolving manufacturing challenges.
• Collaborate teams from various departments to ensure smooth development transfer to all Micron network sites.
• Develop, configure, and optimize Package Assembly processes for Micron's memory products from pathfinding to NPI start-up and certification while collaborating with the global design team.

Requirements

• Ms/ PhD in Electronics/ Mechanical/ Chemical/ Materials Engineering.
• NCG is acceptable.
• Highly motivated individuals with relevant working experience are encouraged to apply.

• Have prior experience in mechanical and material interaction effects on reliability of IC components and/or Printed Circuit Assemblies (PCB) assemblies.

• A team player equipped with excellent interpersonal and communication skills.
• Possess initiative and ability to work independently.
• Good semiconductor failure analysis and materials analysis skills.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

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Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.