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(1)MRDA PROCESS & EQUIPMENT ENGINEER/ MRDA INTEGRATION ENGINEER
-4 or more years of experience in Semiconductor Manufacturing with proven track record of technical leadership in semiconductor manufacturing, preferably in MRDA Process & Equipment Engineering. Experience in other Front-End areas, in PWF & HBM technology is of greater advantage.
MRDA / MRDA
(2)PDE PROCESS INTEGRATION ENGINEER
-The ideal candidate will drive innovation in packaging technology and ensure seamless process integration during new product introductions.
-Requires a strong background in semiconductor packaging, frontend fabrication (FAB) processes, and advanced data analysis skills.
PDE
(3)AMHS (Automated Material Handling System)
-AMHS Tool management in production line and corporation with manufacturing.
-Operation scheduling and SOP documentation.
-AMHS KPI maintain (Tool Utilization, Deliver Time, Maintenance Cost).
-Leading or coordinator of department project (Funding, Design review, Vendor Management).
Abnormal event analysis and improvement plan execution.
AMHS ( )
(4)Senior Process Engineer, Advanced Package
-At least 8 years experience in packaging industry which should include at least 3years in advanced package field.
-Deep knowledge advanced package process development.
-Deep understanding of advance package architecture (2.5D, 3DIC, FO, hybrid bond...etc)
--Excellent data extraction, analysis and reporting skills. (system data mining, JMPetc)
-Understanding of probe, parametric, backend and reliability testing.
-In-depth understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability.
Senior ,
Date Posted: 23/11/2024
Job ID: 101256049